Valens and Samsung Partner to Boost High-Speed Automotive Sensor Chips

Jerusalem, 10 September, 2025 (TPS-IL) — Israeli chipmaker Valens Semiconductor is partnering with Samsung Electronics to develop the next generation of high-speed automotive connectivity chips. These chips help cars send data quickly and reliably between sensors, cameras, and displays—critical for driver-assistance systems and future self-driving vehicles.

Samsung, a long-time partner and early investor in Valens, will manufacture the chips using its advanced automotive production process. The partnership aims to make in-car sensor and display connections faster, safer, and more efficient.

Valens has already secured deals with major European automakers and received support from Mobileye.